Capabilities

At Rapid Circuits our broad experience has given us the ability to provide a wide range of services and capabilities. Among these are:

· Single-sided, double-sided and multilayer boards with up to 24 layers.

· Blind and/or buried vias.

· Substrate materials: FR-4, Duroid, polyimide, ceramic, polymer and all others.

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· Metal plating and depositions: Cu/Ni/Au, immersion & electrolytic gold, Organic coating over bare copper, HASL, lead-free solder, immersion tin, carbon ink, and others.

· Copper thickness: 1/2oz to over 10oz.

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· Masks: LPI, dry film, OSP and others.

· RF and controlled impedance

· Scoring and/or routing

· Board thickness down to 0.020”.

· Lines down to 0.004” on 0.008” centers.

· Board sizes up to 22.5” X 16.5”

· “Palleting” of multiple part numbers per panel for speed and economy

· Mixed surface-mount and thru-hole

· Electrical testing

· 24 hour turn around.

Click here for more information on our Express Service!